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DATE 2010 Friday Workshop
6th IEEE International Workshop on
Silicon Debug and Diagnosis

March 12, 2010
Dresden, Germany

http://www.sdd-online.org

CALL FOR PAPERS
Scope -- Submissions -- Key Dates -- Additional Information -- Committees

Scope

Troubleshooting how and why systems and circuits fail is important and is rapidly growing in industry significance. Debug and diagnosis may be needed for yield improvement, process monitoring, correcting the design function, failure mode learning for R&D, or just getting a working first prototype. This detective work is however very tricky. Sources of difficulty include circuit and system complexity, packaging, limited physical access, shortened product creation cycle and time-to-market, the traditional focus on only pass/fail testing and missing tool and equipment capabilities. New and efficient solutions for debug and diagnosis have a much needed and highly visible impact on productivity.

The topics of interest include, but are not limited to, the following:

  • Debug Techniques and Methodologies
  • Microprocessor, FPGA, IP, SOC Debug
  • Design and Synthesis for Debug
  • Infrastructure IP for SDD
  • DFT Reuse for Debug and Diagnosis
  • System Level Debug & Diagnosis
  • Debug & Diagnosis Architectures
  • Manufacturing & Prototype Environment
  • Tools
  • Equipment Impact and Techniques
  • Debug Standardization
  • Cross-geography turn-on, debug & diagnosis issues
  • SDD vs. Yield & TTM
  • Digital / Analog Turn-on
  • Case studies
  •  

    Submissions

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    The workshop objective is to facilitate a valuable interactive information exchange. Contributions ranging from extended abstracts to full papers are acceptable for submission. Proposals that describe open issues, industry/technology needs or opinions are also welcome.

    • Length Guideline: ranging from a one page, extended abstract up to 8 pages. 
    • Submissions due: November 6th, 2009
    • Acceptance Notification: November 20th, 2009
    • Final papers for inclusion into informal proceedings: March 3rd, 2010

    Proposals for discussion panels and other special sessions are also invited.  Please submit a one page abstract for these to the web site or contact the Program Co-chairs.

    Key Dates

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    Paper Submission deadline: November 6, 2009
    Notification of Acceptance: November 20, 2009
    Camera-Ready Material due date: March 3, 2010

    Additional Information
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    General Information
    Bart Vermeulen
    NXP Semiconductors
    bart.vermeulen@nxp.com 

    Submission & Program Information
    Christian Boit
    Berlin University of Technology
    christian.boit@tu-berlin.de 

    Al Crouch
    ASSET Intertech
    acrouch@asset-intertech.com

    Committees
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    General Chair
    B. Vermeulen – NXP Semiconductors

    Program Co-chairs
    C. Boit – TU Berlin
    A. Crouch – ASSET Intertech

    Asian Liaison
    K. Hatayama – STARC

    European Liaison
    D. Appello – STMicroelectronics

    North-American Liaison
    T. McLaurin – ARM

    University Liaison
    Z. Zilic – McGill Univ.

    Electronic Media
    I. Bayraktaroglu – Sun

    Local Arrangements
    P. Cheung – Imperial College London
    N. Nicolici – McMaster Univ.

    Program Committee
    M. Abadir – Freescale
    M. Abramovici – DAFCA
    B. Benware – Mentor Graphics
    V. Bertacci – Univ. of Michigan
    S. Blanton – Carnegie Mellon Univ.
    B. Cory – nVidia
    B. Eklow – Cisco Systems
    J. Giacobbe – Intel
    R. Guo – Mentor Graphics
    S. Gupta – USC
    I. Hartanto – Xilinx
    Y-C. Hsu – SpringSoft
    D. Josephson – Intel
    R. Kapur – Synopsys
    H. Kerkhoff – Univ. Twente
    C. Metra – Univ. Bologna
    A. Orailoglu – UCSD
    S. Pappalardo – STMicroelectronics
    P. Prinetto – Poli. Di Torino
    M. Renovell – LIRMM
    M.S. Reorda – Poli. Di Torino
    N. Stollon – HDLdynamics
    C. Sul – Silicon Image
    J. Tyzer – U. Poznan
    S. Venkataraman – Intel
    Z. Zilic – McGill Univ.

    Steering Committee
    R. Aitken – ARM
    E.J. Marinissen – IMEC
    F. Muradali – National Semiconductor
    M. Ricchetti – AMD (chair)
    Y. Zorian – Virage Logic

    For more information, visit us on the web at: http://www.sdd-online.org

    The 6th IEEE International Workshop on Silicon Debug and Diagnosis (SDD 2010) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


    IEEE Computer Society- Test Technology Technical Council

    TTTC CHAIR
    Adit D. SINGH
    Auburn University - USA
    Tel. +1-334-844-1847
    E-mail adsingh@eng.auburn.edu

    PAST CHAIR
    André IVANOV
    University of British Columbia - Canada
    Tel. +1-604-822-6936
    E-mail ivanov@ece.ubc.ca

    TTTC 1ST VICE CHAIR
    Michael NICOLAIDIS
    TIMA Laboratory - France
    Tel. +33-4-765-74696
    E-mail michael.nicolaidis@imag.fr

    SECRETARY
    Christian LANDRAULT
    LIRMM - France
    Tel. +33-4-674-18524
    E-mail landrault@lirmm.fr

    ITC GENERAL CHAIR
    Gordon W. ROBERTS
    McGill University
    - Canada
    Tel.
    E-mail gordon.roberts@mcgill.ca

    TEST WEEK COORDINATOR
    Yervant ZORIAN
    Virage Logic Corporation - USA
    Tel. +1-510-360-8035
    E-mail yervant.zorian@viragelogic.com

    TUTORIALS AND EDUCATION
    Dimitris GIZOPOULOS

    University of Piraeus
    - Greece
    Tel. +30-210-414-2372
    E-mail dgizop@unipi.gr

    STANDARDS
    Rohit KAPUR

    Synopsys
    , Inc. - USA
    Tel. +1-650-934-1487
    E-mail rkapur@synopsys.com

    EUROPE
    Zebo PENG
    Linköping University - Sweden
    Tel. +46-13-282-067/-281-000
    E-mail zpe@ida.liu.se

    MIDDLE EAST & AFRICA
    Ibrahim HAJJ
    American University of Beirut - Lebanon
    Tel. +961-1-341-952
    E-mail ihajj@aub.edu.lb

    STANDING COMMITTEES
    André IVANOV
    University of British Columbia - Canada
    Tel. +1-604-822-6936
    E-mail ivanov@ece.ubc.ca

    ELECTRONIC MEDIA
    Alfredo BENSO
    Politecnico di Torino - Italy
    Tel. +39-011-564-7080
    E-mail alfredo.benso@polito.it

     

    PRESIDENT OF BOARD
    Yervant ZORIAN
    Virage Logic Corporation- USA
    Tel. +1-510-360-8035
    E-mail yervant.zorian@viragelogic.com

    SENIOR PAST CHAIR
    Paolo PRINETTO
    Politecnico di Torino - Italy
    Tel. +39-011-564-7007
    E-mail Paolo.Prinetto@polito.it

    TTTC 2ND VICE CHAIR
    Chen-Huan CHIANG

    Alcatel-Lucent
    - USA
    Tel. +1-973-386-6759
    E-mail chenhuan@alcatel-lucent.com

    FINANCE
    Michael NICOLAIDIS
    TIMA Laboratory - France
    Tel. +33-4-765-74696
    E-mail michael.nicolaidis@imag.fr

    IEEE DESIGN & TEST EIC
    K.T. (Tim) CHENG
    University of California, Santa Barbara - USA
    Tel. +1-805-893-72942
    E-mail timcheng@ece.ucsb.edu

    TECHNICAL MEETINGS
    Chen-Huan CHIANG
    Alcatel-Lucent
    - USA
    Tel. +1-973-386-6759
    E-mail chenhuan@alcatel-lucent.com

    TECHNICAL ACTIVITIES
    Matteo SONZA REORDA
    Politecnico di Torino - Italy
    Tel.+39-011-564-7055
    E-mail matteo.sonzareorda@polito.it

    ASIA & PACIFIC
    Kazumi HATAYAMA
    STARC - Japan
    Tel. +
    E-mail hatayama.kazumi@starc.or.jp

    LATIN AMERICA
    Victor Hugo CHAMPAC
    Instituto Nacional de Astrofisica - Mexico
    Tel.+52-22-470-517
    E-mail champac@inaoep.mx

    NORTH AMERICA
    William R. MANN
    SW Test Workshop - USA
    Tel. +1-949-645-3294
    E-mail william.mann@ieee.org

    COMMUNICATIONS
    Cecilia METRA
    Università di Bologna - Italy
    Tel. +39-051-209-3038
    E-mail cmetra@deis.unibo.it

    INDUSTRY ADVISORY BOARD
    Yervant ZORIAN
    Virage Logic Corporation- USA
    Tel. +1-510-360-8035
    E-mail yervant.zorian@viragelogic..com


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